Rainbow-electronics AT24C16A Manual de usuario descargar pdf (Pagina 19)

AT24C02A/04A/08A/16A

0976D–12/01

8T– TSSOP

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

TITLE

DRAWING NO.

REV.

10/26/01

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D 2.90 3.00 3.10 2, 5

E 6.40 BSC

E1 4.30 4.40 4.50 3, 5

A ––1.20

A2 0.80 1.00 1.05

b 0.19 – 0.30 4

e 0.65 BSC

L 0.45 0.60 0.75

L1 1.00 REF

8T, 8-lead, 4.4 mm Body, Plastic

Thin Shrink Small Outline Package (TSSOP)

1. These drawings are for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc.

2. Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side.

3. Dimension "E1" does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side.

4. Dimension "b" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum

material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.

5. Dimension "D" and "E1" to be determined at Datum Plane H.

123

Side View

End View

Top View

Notes:

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