Rainbow-electronics DS1646P Manual de usuario descargar pdf (Pagina 10)

DS1646/DS1646P

10 of 11

DS1646 32-PIN PACKAGE

PKG 28-PIN

DIM MIN MAX

A IN.

1.670

38.42

1.690

38.93

B IN.

0.715

18.16

0.740

18.80

C IN.

0.335

8.51

0.365

9.27

D IN.

0.075

1.91

0.105

2.67

E IN.

0.015

0.38

0.030

0.76

F IN.

0.140

3.56

0.180

4.57

G IN.

0.090

2.29

0.110

2.79

H IN.

0.590

14.99

0.630

16.00

J IN.

0.010

0.25

0.018

0.45

K IN.

0.015

0.38

0.025

0.64

DS1646P

PKG INCHES

DIM MIN NOM MAX

0.920 0.925 0.930

0.980 0.985 0.990

- - 0.080

0.052 0.055 0.058

0.048 0.050 0.052

0.015 0.020 0.025

0.025 0.027 0.030

NOTE:

For the PowerCap version:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder

reflow oriented with the label side up (“live - bug”).

b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to

remove solder.

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Rainbow-electronics DS1646P Manual de usuario Pagina 10

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