Rainbow-electronics MAX5531 Manual de usuario descargar pdf (Pagina 18)

MAX5530/MAX5531

Ultra-Low-Power, 12-Bit,

Voltage-Output DACs

18 ______________________________________________________________________________________

Power Supply and Bypassing

Considerations

Bypass the power supply with a 0.1µF capacitor to GND.

Minimize lengths to reduce lead inductance. If noise

becomes an issue, use shielding and/or ferrite beads to

increase isolation. For the thin QFN package, connect

the exposed paddle to ground.

Layout Considerations

Digital and AC transient signals coupling to GND can

create noise at the output. Use proper grounding tech-

niques, such as a multilayer board with a low-inductance

ground plane. Wire-wrapped boards and sockets are not

recommended. For optimum system performance, use

printed circuit (PC) boards. Good PC board ground lay-

out minimizes crosstalk between DAC outputs, reference

inputs, and digital inputs. Reduce crosstalk by keeping

analog lines away from digital lines.

Figure 8. Bipolar Output Circuit

Figure 9. Separate Force-Sense Outputs Create Unity and

Greater-than-Unity DAC Gains Using the Same Reference

REFIN

MAX5530

OUT

V+

10kΩ 10kΩ

V-

DAC

REFIN

OUT

MAX5530

DAC

Figure 10. Software-Configurable Output Gain

DAC

IS THE NUMERIC VALUE OF THE DAC INPUT CODE.

POT

IS THE NUMERIC VALUE OF THE POT INPUT CODE.

REFIN

MAX5530

MAX5401

SOT-POT

100kΩ

VOUT

5PPM/°C

RATIOMETRIC

TEMPCO

1.8V ≤ V

≤ 5.5V

OUT

REFIN

× N

DAC

4096

(

1 +

255 - N

POT

)

255

SCLK

DIN

CS2

CS1

DAC

Chip Information

TRANSISTOR COUNT: 10,688

PROCESS: BiCMOS

1 2 ... 13 14 15 16 17 18 19

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Rainbow-electronics MAX5531 Manual de usuario Pagina 18

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