Rainbow-electronics MAX5295 Manual de usuario descargar pdf (Pagina 29)

MAX5290–MAX5295

Buffered, Fast-Settling, Dual, 12-/10-/8-Bit,

Voltage-Output DACs

______________________________________________________________________________________ 29

Power-Supply and Layout Considerations

Bypass the analog and digital power supplies with a

10µF capacitor in parallel with a 0.1µF capacitor to ana-

log ground (AGND) and digital ground (DGND) (see

Figure 10). Minimize lead lengths to reduce lead induc-

tance. If noise is an issue, use shielding and/or ferrite

beads to increase isolation.

Digital and AC transient signals coupling to AGND cre-

ate noise at the output. Connect AGND to the highest

quality ground available. Use proper grounding tech-

niques, such as a multilayer board with a low-induc-

tance ground plane. Wire-wrapped boards and sockets

are not recommended. For optimum system perfor-

mance, use printed circuit (PC) boards with separate

analog and digital ground planes. Connect the two

ground planes together at the low-impedance power-

supply source.

Using separate power supplies for AV

and DV

improves noise immunity. Connect AGND and DGND at

the low-impedance power-supply source (see Figure 11).

MAX5290–MAX5295

REF

10µF* 0.1µF*

REF

SCLK

DIN

UPIO1

UPIO2

DSP

AGND** DGND**

OUTA

FBA

FBB

OUTB

MAX5291/

MAX5293/

MAX5295

ONLY

10µF0.1µF0.1µF10µF

*REMOVE BYPASS CAPACITORS ON REF FOR AC-REFERENCE INPUTS.

**CONNECT ANALOG AND DIGITAL GROUND PLANES AT THE

LOW-IMPEDANCE POWER-SUPPLY SOURCE.

Figure 10. Bypassing Power Supplies and Reference

MAX5290–MAX5295

0.1µF

10µF

AGND

0.1µF

10µF

DGND

ANALOG SUPPLY DIGITAL SUPPLY

DIGITAL

CIRCUITRY

Figure 11. Separate Analog and Digital Power Supplies

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