Rainbow-electronics GE863-PY Manual de usuario Pagina 72

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GE863 Hardware User Guide
1vv0300783 Rev.0 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 72 of 80
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
opening”, unless the microvia carry the same signal of the pad itself.
Holes in pad are allowed only for blind holes and not for through holes.
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